View HSOP25_6458686.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

product structure silicon monolithic integrated circuit this product is not designed for pr otection against radioactive rays . 1/19 datashee t tsz02201-0p2p0b300080-1-2 ? 2012 rohm co., ltd. all rights reserved. 25.dec.2012 rev.002 tsz22111 ? 14? 001 www.rohm.com dc brush motor drivers (18v max.) bd622xxx series general description these h-bridge drivers are full bridge drivers for brush motor applications. each ic can operate at a power supply voltage range of 6v to 15v, with output currents of up to 2a. mos transistors in the output stage allow pwm speed control.the integrated vref voltage control function allows dire ct replacement of deprecated motor driver ics. these highly efficient h-bridge driver ics facilitate low-power consumption design. features ? built-in, selectable one channel or two channels configuration ? vref voltage setting pin enables pwm duty control ? cross-conduction prevention circuit ? four protection circuits provided: ocp, ovp, tsd and uvlo applications vtr; cd/dvd players; audio-visual equipment; optical disc drives; pc peripherals; oa equipments key specifications supply voltage range: 18v(max.) maximum output current: 0.5a / 1.0a / 2.0a output on resistance: 1.5 ? / 1.5 ? / 1.0 ? pwm input frequency range: 20 to 100khz standby current: 0 a (typ.) operating temperature range: -40 to 85 packages (typ.) (typ.) (max.) sop8 5.00mm x 6.20mm x 1.71mm HSOP25 13.60mm x 7.80mm x 2.11mm hrp7 9.395mm x 10.540mm x 2.005mm ordering information b d 6 2 2 x x x x - x x part number package packaging and forming specification e2: embossed tape and reel (sop8/HSOP25) tr: embossed tape and reel (hrp7) f fp hfp : sop8 : HSOP25 : hrp7 lineup voltage rating (max.) channels output current (max.) package orderable part number 18v 1ch 0.5a sop8 reel of 2500 bd6220f-e2 1.0a sop8 reel of 2500 bd6221f-e2 2.0a HSOP25 reel of 2000 bd6222fp- e2 hrp7 reel of 2000 bd6222hfp-tr 2ch 0.5a HSOP25 reel of 2000 bd6225fp-e2 1.0a HSOP25 reel of 2000 bd6226fp-e2 hrp7 (pd=1.60w) sop8 (pd=0.69w) HSOP25 (pd=1.45w) * pd : mounted on a 70mm x 70mm x 1.6mm glass-epoxy board.
datasheet datasheet 2/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 block diagrams / pin confi gurations / pin descriptions bd6220f/bd6221f fig.1 bd6220f / bd6221f fig.2 sop8 (top view) bd6222hfp fig.3 bd6222hfp fig.4 hrp7 (top view) pin name function 1 out1 driver output 2 vcc power supply 3 vcc power supply 4 fin control input (forward) 5 rin control input (reverse) 6 vref duty setting pin 7 out2 driver output 8 gnd ground note: use all vcc pin by the same voltage. table 2 bd6222hfp pin name function 1 vref duty setting pin 2 out1 driver output 3 fin control input (forward) 4 gnd ground 5 rin control input (reverse) 6 out2 driver output 7 vcc power supply fin gnd ground out1 vcc vcc fin gnd out2 vref rin vref out1 fin gnd rin out2 vcc table1 bd6220f/bd6221f 3 2 7 1 4 5 ctrl protect fin rin vcc vcc out1 out2 8 gnd 6 vref duty 7 6 2 3 5 ctrl protect fin rin vcc out1 out2 4 gnd 1 vref duty fin gnd
datasheet datasheet 3/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 block diagrams / pin configurati ons / pin descriptions- continued bd6222fp fig.5 bd6222fp fig.6 HSOP25 (top view) bd6225fp / bd6226fp fig.7 bd6225fp / bd6226fp fig.8 HSOP25 (top view) table 3 bd6222fp pin name function 1,2 out1 driver output 6 gnd small signal ground 7,8 rnf power stage ground 12,13 out2 driver output 17 vref duty setting pin 19 rin control input (reverse) 20 fin control input (forward) 21 vcc power supply 22,23 vcc power supply fin gnd ground note: all pins not described above are nc pins. note: use all vcc pin by the same voltage. table 4 bd6225fp / bd6226fp pin name function 1 out1a driver output 3 rnfa power stage ground 6 out2a driver output 8 gnd small signal ground 9 vrefa duty setting pin 10 rina control input (reverse) 11 fina control input (forward) 12 vcc power supply 13 vcc power supply 14 out1b driver output 16 rnfb power stage ground 19 out2b driver output 20 gnd small signal ground 21 vrefb duty setting pin 22 rinb control input (reverse) 23 finb control input (forward) 24 vcc power supply 25 vcc power supply fin gnd ground note: all pins not described above are nc pins. note: use all vcc pin by the same voltage. out1 out1 gnd nc nc nc gnd rnf rnf nc nc nc out2 out2 nc nc gnd vcc vcc vcc fin rin nc vref nc nc nc out1 a nc gnd rnfa nc nc out2 a nc gnd vref a rin a fin a vcc vcc vcc vcc gnd finb rinb vrefb gnd out2b nc nc rnfb nc out1b 24 25 11 10 ctrl protect fina rina vcc vcc 3 rnfa 9 vrefa duty 1 out1a 6 out2a 20 gnd 12 13 23 22 ctrl protect finb rinb vcc vcc 16 rnfb 21 vrefb duty 14 out1b 19 out2b 8 gnd fin gnd 21 22 12 1 20 19 ctrl protect fin rin vcc vcc out1 out2 8 rnf 17 vref duty 6 gnd 2 13 7 23 fin gnd
datasheet datasheet 2/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 absolute maximum ratings (ta=25 , all voltages are with respect to ground) parameter symbol ratings unit supply voltage vcc 18 v output current i omax 0.5 * 1 / 1.0 * 2 / 2.0 * 3 a all other input pins v in -0.3 to vcc v operating temperature t opr -40 to +85 storage temperature t stg -55 to +150 power dissipation pd 0.687 * 4 / 1.6 * 5 / 1.45 * 6 w junction temperature t jmax 150 *1 bd6220 / bd6225. do not exceed pd or aso. *2 bd6221 / bd6226. do not exceed pd or aso. *3 bd6222. do not exceed pd or aso. *4 sop8 package. mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. derate by 5.5mw/ above 25 . *5 hrp7 package. mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. derate by 12.8mw/ above 25 . *6 HSOP25 package. mounted on a 70mm x 70mm x 1.6mm glass-epoxy board. derate by 11.6mw/ above 25. recommended operating ratings (ta=25 ) parameter symbol ratings unit supply voltage vcc 6 to 15 v vref voltage vref 3 to 15 v electrical characteristics (unl ess otherwise specified, ta=25 and vcc=vref=12v) parameter symbol limits unit conditions min. min. min. supply current (1ch) i cc 0.8 1.3 2.5 ma forward / reverse / brake supply current (2ch) i cc 1.3 2.0 3.5 ma forward / reverse / brake stand-by current i stby - 0 10 a stand-by input high voltage v ih 2.0 - - v input low voltage v il - - 0.8 v input bias current i ih 30 50 100 a v in =5.0v output on resistance * 1 r on 1.0 1.5 2.5 ? i o =0.25a, vertically total output on resistance * 2 r on 1.0 1.5 2.5 ? i o =0.5a, vertically total output on resistance * 3 r on 0.5 1.0 1.5 ? i o =1.0a, vertically total vref bias current i vref -10 0 10 a vref=vcc carrier frequency f pwm 20 25 35 khz vref=9v input frequency range f max 20 - 100 khz fin / rin *1 bd6220 / bd6225 *2 bd6221 / bd6226 *3 bd6222
datasheet datasheet 5/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves (reference data) 0.5 1.0 1.5 2.0 6 9 12 15 18 supply voltage: vcc [v] circuit current: icc [ma] 85c 25c -40c fig.9 supply current (1ch) fig.10 supply current (2ch) 1.0 1.5 2.0 2.5 6 9 12 15 18 supply voltage: vcc [v] circuit current: icc [ma] 85c 25c -40c -0.5 0.0 0.5 1.0 1.5 11.21.41.61.82 input voltage: vin [v] internal logic: h/l [-] _ -40c 25c 85c -40c 25c 85c fig.11 input threshold voltage fig.12 input bias current 0 100 200 300 400 0 6 12 18 input voltage: vin [v] input bias current: iih [a] _ 85c 25c -40c
datasheet datasheet 6/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves (reference data) - continued 0.0 0.2 0.4 0.6 0.8 1.0 0 0.2 0.4 0.6 0.8 1 input voltage: vref / vcc [v] switching duty: d [ton/t] _ -40c 25c 85c fig.14 vref - duty(vcc=12v) -10 -5 0 5 10 0 6 12 18 fig.13 vref input bias current input voltage: vref [v] input bias current: ivref [ a] -40c 25c 85c fig.15 vcc - carrier frequency fig.16 under voltage lock out 10 20 30 40 6 9 12 15 18 supply voltage: vcc [v] oscillation frequency: f pwm [khz] 85c 25c -40c 0 3 6 9 44.555.56 supply voltage: vcc [v] internal signal: release [v] _ 85c 25c -40c
datasheet datasheet 7/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves(reference data) - continued fig.17 over voltage protection fig.18 thermal shutdown 0 7 14 21 28 35 20 24 28 32 supply voltage: vcc [v] internal signal: release [v] -40c 25c 85c -0.5 0.0 0.5 1.0 1.5 125 150 175 200 junction temperature: tj [c] internal logic: h/l [-] fig.20 over current protection (l side) fig.19 over current protection (h side) -0.5 0.0 0.5 1.0 1.5 2 2.5 3 3.5 4 load current / iomax: normalized internal logic: h/l [-] 85c 25c -40c -0.5 0.0 0.5 1.0 1.5 11.251.51.752 load current / iomax: normalized internal logic: h/l [-] 85c 25c -40c
datasheet datasheet 8/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves (reference data) - continued fig.21 output high voltage (bd6220/25) fig.22 output high voltage (bd6221/26) 0 0.2 0.4 0.6 0.8 0 0.2 0.4 0.6 0.8 1 output current: iout [a] output voltage: vcc-vout [v] 85c 25c -40c 0 0.1 0.2 0.3 0.4 0 0.1 0.2 0.3 0.4 0.5 output current: iout [a] output voltage: vcc-vout [v] 85c 25c -40c fig.23 output high voltage (bd6222) 0 0.1 0.2 0.3 0.4 0 0.1 0.2 0.3 0.4 0.5 output current: iout [a] output voltage: vcc-vout [v] 85c 25c -40c 0 0.5 1 1.5 2 0 0.1 0.2 0.3 0.4 0.5 output current: iout [a] output voltage:vcc-vout [v] -40c 25c 85c fig.24 high side body diode (bd6220/25)
datasheet datasheet 9/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves (reference data) - continued fig.25 high side body diode (bd6221/26) fig.26 high side body diode (bd6222) 0 0.5 1 1.5 2 0 0.2 0.4 0.6 0.8 1 o utp ut curr ent: io ut [a] output voltage:vcc-vout [v] -40c 25c 85c 0 0.5 1 1.5 2 0 0.4 0.8 1.2 1.6 2 o utp ut curr ent: io ut [a] output voltage:vcc-vout [v] -40c 25c 85c fig.27 output low voltage (bd6220/25) fig.28 output low voltage (bd6221/26) 0 0.3 0.6 0.9 1.2 0 0.2 0.4 0.6 0.8 1 o utp ut curr ent: io ut [a] output voltage: vout [v] 85c 25c -40c 0 0.1 0.2 0.3 0.4 0 0.1 0.2 0.3 0.4 0.5 o utp ut curr ent: io ut [a] output voltage: vout [v] 85c 25c -40c
datasheet datasheet 10/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves (reference data) - continued fig.32 low side body diode (bd6222) fig.31 low side body diode (bd6221/26) 0 0.5 1 1.5 2 0 0.2 0.4 0.6 0.8 1 output current: iout [a] output voltage: vout [v] -40c 25c 85c 0 0.5 1 1.5 2 0 0.4 0.8 1.2 1.6 2 output current: iout [a] output voltage: vout [v] -40c 25c 85c fig.30 low side body diode (bd6220/25) 0 0.3 0.6 0.9 1.2 0 0.4 0.8 1.2 1.6 2 output current: iout [a] output voltage: vout [v] 85c 25c -40c fig.29 output low voltage (bd6222) 0 0.5 1 1.5 2 0 0.1 0.2 0.3 0.4 0.5 output current: iout [a] output voltage: vout [v] -40c 25c 85c
datasheet datasheet 11/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 functional descriptions 1) operation modes table 5 logic table fin rin vref out1 out2 operation a l l x hi-z* hi-z* stand-by (idling) b h l vcc h l forward (out1 > out2) c l h vcc l h reverse (out1 < out2) d h h x l l brake (stop) e pwm l vcc h pwm __________ forward (pwm control mode a) f l pwm vcc pwm __________ h reverse (pwm control mode a) g h pwm vcc pwm __________ l forward (pwm control mode b) h pwm h vcc l pwm __________ reverse (pwm control mode b) i h l option h pwm __________ forward (vref control) j l h option pwm __________ h reverse (vref control) * hi-z : all output transistors are off. please note that this is the state of the connected diodes, which differs from that of the mechanical relay. x : don?t care a) stand-by mode stand-by operates independently with the vref pin voltage. in stand-by mode, all internal circuits are turned off, including the output power transistors. motor output goes to high impedance. when the system is switched to stand-by mode while the motor is running, the system enters an idling state because of the body diodes. however, when the system switches to stand-by from any other mode (except the brake mode), the control logic remains in the high state for at least 50s before shutting down all circuits. b) forward mode this operating mode is defined as the forward rotation of the motor when the out1 pin is high and out2 pin is low. when the motor is connected between the out1 and out2 pins, the current flows from out1 to out2. to operate in this mode, connect the vref pin to the vcc pin. c) reverse mode this operating mode is defined as the reverse rotation of the motor when the out1 pin is low and out2 pin is high. when the motor is connected between the out1 and out2 pins, the current flows from out2 to out1. to operate in this mode, connect the vref pin to the vcc pin. d) brake mode this operating mode is used to quickly stop the motor (shor t circuit brake). it differs from the stand-by mode because the internal control circuit is operating in the brake mode. please switch to stand-by mode (rather than the brake mode) to save power and reduce consumption. a) stand-by mode b) forward mode c) reverse mode d) brake mode fig.33 four basic operations (output stage) m on off off on m off on on off m off on off on off off off off m
datasheet datasheet 12/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 e) f) pwm control mode a the rotational speed of the motor can be controlled by the duty cycle of the pwm signal fed to the fin pin or the rin pin. in this mode, the high side output is fixed and the low side output is switching, corresponding to the input signal. the state of the output toggles between "l" and "hi-z". the frequency of the input pwm signal can be between 20khz and 100khz. the circuit may not operate properly for pwm frequencies below 20khz and above 100khz. note that control may not be attained by switching on duty at frequencies lower than 20khz, since the operation functions via the stand-by mode. to operate in this mode, connect the vref pin to the vcc pin. in addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10f or higher is recommended) between vcc and ground. control input : h control input : l fig.34 pwm control mode a operation (output stage) fig.35 pwm control mode a operation (timing chart) g) h) pwm control mode b the rotational speed of the motor can be controlled by the duty cycle of the pwm signal fed to the fin pin or the rin pin. in this mode, the low side output is fixed and the high side output is switching, corresponding to the input signal. the state of the output toggles between "l" and "h". the frequency of the input pwm signal can be between 20khz and 100khz. the circuit may not operate properly for pwm frequencies below 20khz and above 100khz. to operate in this mode, connect the vref pin to the vcc pin. in addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10f or higher is recommended) between vcc and ground. control input : h control input : l fig.36 pwm control mode b operation (output stage) fig.37 pwm control mode b operation (timing chart) fin rin out1 out2 fin rin out1 out2 m on off off on m on off off off m on off off on m on off off off
datasheet datasheet 13/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 i) j) vref control mode the built-in vref duty cycle conversion circuit provides a duty cycle corresponding to the voltage of the vref pin and the vcc voltage. the function offers the same level of control as the high voltage output setting function in previous models. the duty cycle is calculated by the following equation. duty vref [v] / vcc [v] for example, if vcc voltage is 12v and vref pin voltage is 9v, the duty cycle is about 75 percent. however, please note that the duty cycle might be limited by the range of the vref pin voltage (refer to the operating conditions, shown on page 2). the pwm carrier frequency in this mode is 25khz (nominal), and the switching operation is the same as the pwm control modes. when operating in this mode, do not input a pwm signal to the fin and rin pins. in addition, establish a current path for the recovery current from the motor, by connecting a bypass capacitor (10f or more is recommended) between vcc and ground. fig.38 vref control operation (timing chart) 2) cross-conduction protection circuit in the full bridge output stage, when the upper and lower transistors are turned on at the same time during high to low or low to high transition, an inrush current flows from the power supply to ground, resulting to a loss. this circuit eliminates the inrush current by providing a dead time (about 400ns, nominal) during the transition. 3) output protection circuits a) under voltage lock out (uvlo) circuit to ensure the lowest power supply voltage necessary to operate the controller, and to prevent under voltage malfunctions, a uvlo circuit has been built into this driver. when the power supply voltage falls to 5.0v (nominal) or below, the controller forces all driver outputs to high imp edance. when the voltage rises to 5.5v (nominal) or above, the uvlo circuit ends the lockout operation and returns the chip to normal operation. b) over voltage protection (ovp) circuit when the power supply voltage exceeds 30v (nominal), the controller forces all driver outputs to high impedance. the ovp circuit is released and its operation ends when the voltage drops back to 25v (nominal) or below. this protection circuit does not work in the stand-by mode. also, note that this circuit is supplementary, and thus if it is asserted, the absolute maximum rating will have been exceeded. therefore, do not continue to use the ic after this circuit is activated, and do not operate the ic in an environment where activation of the circuit is assumed. vcc vref fin rin out1 out2 0
datasheet datasheet 14/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 c) thermal shutdown (tsd) circuit the tsd circuit operates when the junction temperature of the driver exceeds the preset temperature (175 nominal). at this time, the controller forces all driver out puts to high impedance. since thermal hysteresis is provided in the tsd circuit, the chip returns to normal operation when the junction temperature falls below the preset temperature (150 nominal). thus, it is a self-resetting circuit. the tsd circuit is designed only to shut the ic off to prevent thermal runaway. it is not designed to protect the ic or guarantee its operation in the presence of extreme heat. do not continue to use the ic after the tsd circuit is activated, and do not operate the ic in an environment where activation of the circuit is assumed. d) over current protection (ocp) circuit to protect this driver ic from ground faults, power supply line faults and load short circuits, the ocp circuit monitors the output current for the circuit?s monitoring time (10s, nominal). when the protection circuit detects an over current, the controller forces all driver outputs to high impedance during the off time (290s, nominal). the ic returns to normal operation after the off time period has elapsed (self-returning type). at the two channels type, this circuit works independently for each channel. fig.39 over current protection (timing chart) i/o equivalent circuit fig.40 fin / rin fig.41 vref fig.42 out1 / out2 fig.43 out1 / out2 (sop8/hrp7) (HSOP25) threshold iout ctrl input internal status monitor / timer 0 off on mon. off timer on fin vcc rin 100k 100k vref vcc 10k out1 out2 vcc gnd vcc out1 out2 rnf gnd
datasheet datasheet 15/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 operational notes 1) absolute maximum ratings operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. 2) reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 3) power supply lines design the pcb layout pattern to provide low impedance ground and supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in t he ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 4) ground voltage the voltage of the ground pin must be the lowest voltage of all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. 5) thermal consideration use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. consider pc that does not exceed pd in actual operating conditions (pc pd). package power dissipation : pd (w)=(tjmax ta ) / ja power dissipation : pc (w)=(vcc vo)io+vccib tjmax : maximum junction temperature=150 , ta : peripheral temperature[ ] , ja : thermal resistance of package-ambience[ /w], pd : package power dissipation [w], pc : power dissipation [w], vcc : input voltage, vo : output voltage, io : load, ib : bias current 6) short between pins and mounting errors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit may be caused by conductive particles caught between the pins. 7) operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 8) area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 9) capacitor between output and gnd if a large capacitor is connected between the output pin and gnd pin, current from the charged capacitor can flow into the output pin and may destroy the ic when the vcc or vin pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 10uf between output and gnd. 10) testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 11) switching noise when the operation mode is in pwm control or vref control, pwm switching noise may affect the control input pins and cause ic malfunctions. in this case, insert a pull down resistor (10k ? is recommended) between each control input pin and ground.
datasheet datasheet 16/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 12) regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of th e p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a pin b other adjacent elements e b c gnd parasitic element parasitic element fig.44 example of monolithic ic structure
datasheet datasheet 17/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 physical dimensions tape and reel information ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) sop8 0.90.15 0.3min 4 + 6 ? 4 0.17 +0.1 - 0.05 0.595 6 43 8 2 5 1 7 5.00.2 6.20.3 4.40.2 (max 5.35 include burr) 1.27 0.11 0.420.1 1.50.1 s 0.1 s (unit : mm) HSOP25 7.8 0.3 5.4 0.2 2.75 0.1 1.95 0.1 25 14 1 13 0.11 1.9 0.1 0.36 0.1 12.0 0.2 0.3min. 0.25 0.1 13.6 0.2 0.8 (max 13.95 include burr) s 0.1 s ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs e2 () direction of feed reel 1pin direction of feed 1pin reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 2000pcs tr ( ) (unit : mm) hrp7 s 0.08 0.730.1 1.27 0.8875 1.9050.1 0.8350.2 1.5230.15 10.540.13 0.080.05 (max 9.745 include burr) 9.3950.125 s 1.0170.2 8.00.13 0.27 +0.1 - 0.05 4.5 + 5.5 ? 4.5 8.820.1 (6.5) 765432 1 (7.49)
datasheet datasheet 18/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 marking diagrams part number package part number marking bd6220f sop8 6220 bd6221f sop8 6221 bd6222hfp hrp7 bd6222hfp bd6222fp HSOP25 bd6222fp bd6225fp HSOP25 bd6222fp bd6226fp HSOP25 bd6222fp hrp7 (top view) part number marking lot number 1pin mark sop8(top view) part number marking lot number 1pin mark HSOP25 (top view) part number marking lot number 1pin mark
datasheet datasheet 19/19 bd622xxx series tsz02201-0p2p0b300080-1-2 25.dec.2012 rev.002 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 revision history date revision changes 14.mar.2012 001 new release 25.dec.2012 002 improved the statement in all pages. deleted ?status of this document? in page 16.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

▲Up To Search▲

Price & Availability of HSOP25

	To Download HSOP25 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .